Produkttyp: 8 Layer Rigid-Flex PCB Boards
Uwendungen: VR Smart Brëller
Linn Breet a Linn Abstand: 0.1mm / 0.1mm
Board Dicke: 1,2 mm ± 10%
Schichten Stackup: 2+4+2
Minimum Ouverture: 0,15 mm
Kupfer Lach Dicke: 35um
Surface Behandlung: ENIG 2-3uin
Impedanz:/
Warpage: ≦ 0,5%
Toleranz Genauegkeet: ± 0.1MM
Capel's Service:
Support Benotzerdefinéiert1-30 Layer FPC flexibel PCB,2-32 Layer steiwe-Flex Circuit Conseils,1-60 Layer steiwe PCB,HDI PCB, Zuverlässeg Quick Turn PCB Prototyping, Fast Turn SMT PCB Assemblée
Industrie Mir Service:
Medical Device, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
