Produit Typ: 8 Layer HDI Second-Order Flex-Steif PCB
Uwendungen: Automotive
Material: PI, Kupfer, Klebstoff, FR4
Linn Breet a Linn Abstand: 0.1mm / 0.1mm
Borddicke: 1,0 mm +/- 0,03 mm
Minimum Loch: 0,1 mm
Blind Lach: L1-L2, L7-L8
Begruewe Lach: L2-L3, L4-L5, L6-L7
Plating Lach Fëllung: Jo
Surface Behandlung: ENIG 2-3uin
Impedanz:/
Toleranz Toleranz: ± 0.1MM
Capel's Service:
Support Custom 1-30 Layer FPC Flexible PCB, 2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,HDI PCB,Reliable Quick Turn PCB Prototyping, Fast Turn SMT PCB Assembly
Industrie Mir Service:
Medical Device, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
